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            CP12 proberLocation:Home  >>  Product

            CP12 prober

             

            Item

            CP12 prober

            Dimension

            1620mm(W) *1230D*1450mm(H)

            Wafer

            200mm,300mm

            Wafer thickness

            250~2000μm

            Die Size

            350μm ~76,000μm

            Transfer mode

            Vacuum suction, dual arms

            Accuracy

            XY±1.5μmZ±2.5μm

            XY platform

            Probing area ± 170mm, repeated positioning accuracy ± 1μm

            Z axis

            Repeated positioning accuracy ± 1.5μm, max speed 30mm/s

            Force

            50kg (optional 200kg)

            Calibration

            Image calibration, with high/low–power template

            Index time

            240ms (based on die size 6mm,Z clearance 0.5mm)

            Test temperature

            Ambient~150±1

            Communication interface

            GPIB, reserved TTL and RS232

            Option

            ID reading, auto card exchange

            Refer to the prober for CIS and SOC device.

             

            Copyright: Hangzhou ChangChuan Technology Co.,Ltd. Address: No. 410 Jucai Road, Binjiang District, Hangzhou

            Tel: +86-571-85096193 Fax: +86-571-88830180 Technical support: GXR Network

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